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INDOPLAS, INDOPACK, INDOPRINT 2014    2014-07-24 13:49:56

INDOPLAS, INDOPACK, INDOPRINT 2014

Date:9/3~9/6, 2014

Venue:Jakarta International Expo

Booth No. :Hall D1, A02

CHINUP TECHNOLOGY CO., LTD. will present high quality automatic die-cutting machine in the INDOPLAS, INDOPACK, INDOPRINT 2014 of Jakarta International Expo. Welcome to visit us, and see how we increase your production efficiency and save your production cost by our tailor-made systems.

INDOPLAS, INDOPACK, INDOPRINT 2014 gearing for growth amidst Indonesia's buoyant plastics, packaging and printing sectors, with 12,931 high-quality trade visitors at INDOPRINT and another 8,061 at INDOPACK and INDOPLAS spanning across 31 countries, the 2012 editions saw a significant increase from previous years, further illustrating the importance of the three synergistic exhibitions as a vital business platform for the Indonesian market. The three exhibitions included some 253 exhibiting companies who shared their latest product developments, applications and solutions for the industries. In line with the exhibitions' 2012 theme "going global" the exhibitions also saw participation from national groups and pavilions from Austria, Germany, Singapore and Taiwan that contributed to further raising the international standard of the exhibitions.

Chinup Technology Co., Ltd. TEL : 886-6-3841321  FAX : 886-6-3842653  E-mail:info@mail.chinup.com.tw  
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